台积电的System on Wafer-X


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送交者: 2pz 于 2025-04-24 04:53:12

TSMC shows off new tech for stitching together bigger, faster chips

SANT CLARA, California (Reuters) -Taiwan Semiconductor Manufacturing Co (TSM) on Wednesday unveiled technology for making faster chips and putting them together in dinner-plate sized packages that will boost performance needed for artificial intelligence applications.

its forthcoming "System on Wafer-X" will be able to weave together at least 16 large computing chips, as well as memory chips and fast optical interconnections and new technology to deliver thousands of watts of power to the chips.

By comparison, Nvidia\'s current flagship graphics processing units consist of two large chips stitched together and its "Rubin Ultra" GPUs due out in 2027 will stitch four together.
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